![Computer CPU heat dissipation test using EGaIn‐CuP@Cl composite as TIM.... | Download Scientific Diagram Computer CPU heat dissipation test using EGaIn‐CuP@Cl composite as TIM.... | Download Scientific Diagram](https://www.researchgate.net/publication/354539525/figure/fig5/AS:1095568784928768@1638215361852/Computer-CPU-heat-dissipation-test-using-EGaIn-CuPCl-composite-as-TIM-a-Optical-images.png)
Computer CPU heat dissipation test using EGaIn‐CuP@Cl composite as TIM.... | Download Scientific Diagram
![Tinfoil hat on* This is the real reason why AMD solder their CPU. The suction between the cooler and IHS is TOO great! Yes that is the IHS of a 2200G stuck Tinfoil hat on* This is the real reason why AMD solder their CPU. The suction between the cooler and IHS is TOO great! Yes that is the IHS of a 2200G stuck](https://i.redd.it/89emaqf9t2w51.jpg)
Tinfoil hat on* This is the real reason why AMD solder their CPU. The suction between the cooler and IHS is TOO great! Yes that is the IHS of a 2200G stuck
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